| 摘要 |
PURPOSE:To improve an integration density and a packaging density and to facilitate the change in a circuit, by sticking two or more semiconductor devices by fusing bumps, which are formed on semiconductor elements with metal plating having fusing property, and electrically conducting the devices. CONSTITUTION:A lower semiconductor device 1 has two kinds of electrodes 4 for contacts between semiconductors and electrodes 5 for external contacts. An upper semiconductor device 3 has electrodes 4 for contacts between the semiconductor devices and bumps 2, which are formed with metal plating having fusing property on said electrodes 4. At first, the upper semiconductor device 3 is heated, and the bumps 2, which are formed on the semiconductor device electrodes with the metal plating having the fusing property, are fused. The device 3 is stuck to the lower semiconductor device 1 so that the active surfaces face to each other. Therefore, self-alignment based on the surface tension of the fused metal is applied, and high accuracy is not required in position alignment of the upper and lower semiconductor devices 1 and 3. |
