| 摘要 |
PURPOSE:To prevent the yield of trouble such as a loss of a heat conducting medium, by forming protruded parts for preventing close contact of the heat radiating surface of a semiconductor element and a solder bonding surface between both surfaces and for concentrating contact pressure between both surfaces. CONSTITUTION:A heat sink 6 has a plurality of protruded parts 5 on a heat absorbing endothermic surface, i.e., a solder bonding surface 6a, which faces a heat radiating surface 1a of a semiconductor element 1. Therefor, a fused-state heat conducting medium, i.e., a low-fusing point solder 2, is stored in a gap H, which is formed between the heat radiating surface 1a and the solder bonding surface 6a owing to the protruded parts 5. Furthermore, owing to the action of the surface tension of the solder itself, the flowing-out of the solder is prevented. When the number of the protruded parts 5 is especially made to be three, and the parts are arranged in a hoof shape, the stable gap H shape can be formed.
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