| 摘要 |
<p>PURPOSE:To manufacture multipin package at low cost with simplified formation by a method wherein resin made of material at the cost lower than that of ceramic glass type PGA package is adopted. CONSTITUTION:A chip 1 and the lead terminal 5a of a frame 7a near an island 2 are bonded to each other by a wire 4 using a leadframe with dual frames 7a, 7b to form outer end around the central island 2 and then the end of lead terminal 5a and a subpin 3 around the periphery of island 2 is sealed with resin 6a. Next, the inner frame 7a is removed and the lead terminal 5a is bent perpendicular to the frame surface to form an outer terminal. In such a constitution, the lead terminal 5b of outer frame 7b and the chip 1 are bonded to each other by a wire 4; the end of lead terminal 5b and the subpin 3 are sealed with resin 6b to cut off and remove the frame 7b; the lead terminal 5b exposed from the side of resin 6b is bent downward to form an outer terminal further to be sealed with resin 6c; and finally the subpin 3 is cut off.</p> |
