| 摘要 |
PURPOSE:To obtain a simple molding apparatus for semiconductor device and the like, which is suitable for small amount of production for many kindes of products, by the constitution, wherein a supplied tablet is sucked and then turned by 90 deg. so as to face another tablet, and molding heads, which are brought closer from both sides of a lead frame and perform packaging, are provided. CONSTITUTION:A sent-out lead frame 24 is further fed to a holding part 18 through a loader 12. A tablet transfer part 14 is operated during this time. A tablet is sucked and lifted from a tablet container part 13. The tablet is turned by 90 deg. and transferred on a preheating part 15. The tablet is heated and formed in a boat shape. Thereafter, the boat is sucked by the tablet transfer part 14, turned by 90 deg. and transferred to molding heads 16 and 17. A bonding agent is applied on the bonding part of the boat as required. A pair of the molding heads 16 and 17 is turned by 90 deg. under the state the boat is sucked. The heads are brought closer so that they face to each other with the holding part 18 in-between. The lead frame 24 is compressed from both sides. The boat is bonded and a semiconductor device and the like are sealed.
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