| 摘要 |
PURPOSE:To effectively fix a conductor pin to a metal substrate by considering relationship between the fixed portion of the pin and a metal material by devising the shape of the conductor pin fixing portion of the substrate by using the metal substrate. CONSTITUTION:An insulating layer 2 is formed in a through-hole 1a of a metal substrate 1, and a through-hole 2a formed substantially at the center of the layer 2 so that its sectional corner is substantially right angle, a conductor layer 4 and a conductor pin 3 having a supporting portion 3a to be fixed to the hole 2a are prepared. The inner diameter of the hole 2a is in a range of 50-99% of the outer diameter of the supporting portion 3a. The portion 3a of the pin is forcibly engaged with the hole 2a to fix the pin 3 the substrate 1. With this configuration, the conductor pin can be readily and effectively fixed perpendicularly to the small-sized substrate. The substrate is made of metal to provide good heat sink and sufficient mechanical strength. |
