摘要 |
PURPOSE:To prevent generation of voids in the sealing layer by displacing the dropping position of mold material for subassembly to both sides from the center where the pellet exists and winding the molding material at the two positions. CONSTITUTION:The dropping position of mold material M for the subassembly 10 holding a pallet 1 between the electrode materials having a header 2a and a flanges 2b is selected between the header 2a and flange 2b. The mold material M is wound by the subassembly 10 due to rotation of subassembly 10 and dropping of mold material M in the specified amount is terminated. When rotation is continued, the sealing layer 4 of almost spherical form is molded by the swaying ability and centrifugal force of mold material M. As the mold material M, the epoxy resin having the epoxy group in the molecule including organic dibasic acid dihydrazide and imidazole compound may be used. According to this structure, a highly reliable device can be obtained by suppressing generation of voids in the sealing layer.
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