发明名称 MOLDING OF LAMINATED BOARD
摘要 <p>PURPOSE:To eliminate the remaining of bubbles by a method wherein the inside and periphery of a molding material is evacuated and a heating plate is interposed between the molding materials while the molding materials are heated from inside in conjunction with the heating from outside, which is effected by gas. CONSTITUTION:In a rack 6 on a truck 7, to be sent into a pressure vessel 1, three sheets of prepregs, consisting of glass fiber cloth impegnated with epoxy resin, and a plurality of molding material 8, on which copper foils are laminated, are put on a table board 12 on a board body 13. The periphery of the molding materials is covered by a nylon film 16 and the end part of the film is bonded by bonding agent to the end of the board body 13. The periphery of the molding materials 8 is evacuated by a vacuum pump 2 through a penetrating hole 14 at the center of the board body 13 to a predetermined pressure, thereafter, the vessel is filled with gas, such as nitrogen gas, carbon dioxide or the like, to pressurize the molding materials 8 from the outside of the film 16. Subsequently, the inside of the pressure vessel 1 is heated synchronizing with the heating of a heating plate 17, arranged between the molding materials, whereby the laminated plates are heated from the inside thereof and they are molded without remaining bubbles therein.</p>
申请公布号 JPS62128734(A) 申请公布日期 1987.06.11
申请号 JP19850270095 申请日期 1985.11.29
申请人 AICA KOGYO CO LTD 发明人 ANDO MITSUO
分类号 B32B37/10;B29C70/06;B29K105/06;B29L9/00;B32B37/00;H05K3/02;H05K3/46 主分类号 B32B37/10
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