| 摘要 |
A radiation-sensitive composition is described, which is comprised of (1) a polymer containing repeating units of the formula: <IMAGE> wherein R1 is a trivalent or tetravalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R2 is a divalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R3 is hydrogen or an ammonium ion, n is 1 or 2, and COOR3 is located in an ortho or peri position with respect to the amide linkage, (2) an organic compound having a radiation-dimerizable or radiation-polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt, and (3) an aromatic secondary or tertiary amine compound which is chemically inactive to actinic radiation. This composition has an improved photo-sensitivity or radiation sensitivity and can give highly heat-resistant relief patterns with a good edge sharpness and good mechanical and chemical properties as well as good insulating properties. Heat-resistant relief patterns obtained from this composition are especially useful as insulating, passivating or protective coatings in semiconductor devices. |
