Bypass element

摘要

A bypass element (1) for electrically conductive components (20). It is the object of the invention to construct the bypass element (1) in such a manner that only a very very small current flows through it as long as the components (20) are fully functional. The bypass element (1) is formed by a semiconductor component (2) which exhibits a minimum reverse current. The semiconductor component (2) is partially embedded in a metallic component (3) which is formed by a layer of copper or two layers (3B, 3C) of aluminium and copper. If the impedance component (20), with which the bypass element (1) is connected in parallel, becomes high, the bypass element (1) takes over the entire current. At the same time, its current cross-section is widened so that its resistance is lowered.