| 摘要 |
PURPOSE:An epoxy resin composition, obtained by using an imidazole compound having a specific chemical structure as a curing agent, having a long pot life and little reduction in viscosity at high temperatures and curable in a short time to give cured articles having high heat resistance. CONSTITUTION:An epoxy resin composition obtained by containing (A) a polyepoxy compound having >=2 epoxy groups in one molecule, (B) an imidazole compound expressed by the formula (R is organic substituent group; X is -CH2OH, benzyl or -CH3) and (C) a thermoplastic resin, e.g. polyether sulfone, phenoxy resin, polyamide, etc. The amount of the components based on 100pts. wt. component (A) are normally as follows; 1-20pts.wt. component (B) and 5-40pts.wt. component (C). USE:When used as a matrix resin for prepreg of fiber-reinforced plastics, the composition becomes a prepreg, having improved tack, drapeability and moldability and capable of giving molded articles having high toughness.
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