发明名称 SUNSTRATE FOR MODULE
摘要 PURPOSE:To improve the productivity and economical efficiency by a method wherein a ceramic sheet with hole diameter two times or more pin diameter is formed and backed previously in the stage of green sheet to be filled with resin etc. easy for making holes before hardening process. CONSTITUTION:Holes around 5 times larger than pin diameter are made in a green sheet of Al2O3 in alignment with positions of connecting pins 4 of organic collective laminated substrate 3 to be heat-backed. Next the holes in Al2O3 sheet after baking process are filled with resin composition comprising 100wt% of epoxy resin, 10wt% of hardener dicyanide.diamide, 5wt% of hardening accelerator and 200wt% of quartz powder as filler to be heat-hardened. The Al2O3 sheet and the resin filler are ground to be flattened. Further, holes slightly larger than pin diameter are drilled in the resin filled part of Al2O3 sheet. Finally the surface of organic collective laminated substrate bonded with Al2O3 sheet is coated with resin to be heat-hardened under pressure.
申请公布号 JPS62128165(A) 申请公布日期 1987.06.10
申请号 JP19850267162 申请日期 1985.11.29
申请人 HITACHI LTD 发明人 SUGAWARA TOSHIO;TAKAHASHI AKIO;ONO MASAHIRO;WAJIMA MOTOYO;NARAHARA TOSHIKAZU
分类号 H01L23/12;H01L21/48;H01L23/52 主分类号 H01L23/12
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