| 摘要 |
PURPOSE:To prevent generation of a gap between a lead and a resin package by a method wherein the width of the upper resin molding part of the resin package is made smaller than the width of the lower molding part. CONSTITUTION:The width W2 of the upper resin molding part 5 is formed smaller by 100mum or thereabout than the width W1 of the lower resin molding part 6. When a lead 2 is bent downward at the supporting point 2a, as both side edges of the upper resin molding part 6 are not present at the above- mentioned position even when the thickness of the lead 2 is reduced by stretching the outside of the lead 2 and also the external force working to push downward is applied to the lead 2, no exfoliation is generated between the lead 2 and the upper resin molding part 6, and no gas b1 is generated. Also, when metal molds are set, both side edges of the upper resin molding part 6 do not protrude over the lead 2 even when a positional deviation is generated on both left and right sides, because the positional deviation is normally 40mum or thereabout. Accordingly, the gap b2 is not generated. |
