发明名称 LEAD FRAME
摘要 PURPOSE:To restrain the wear on punches and dies when cutting off a tie-bar by a method wherein the tie-bar is arranged to approach a resin package as near as possible while throughholes are made along both edges of outer leads at the resin package side. CONSTITUTION:A tie-bar 3 is arranged to approach the outer edge of resin package 4 as near as possible while very small amount, if any, of resin dams 5 flow out to between tie-bar 3 and the outer edge. Besides, throughholes 6 are made along both edges of outer leads 3 at the positions of tie-bar 3 approaching the resin package 4 to deteriorate the mechanical strength of tie-bar 3 at the positions concerned. To cut off the tie-bar 3, a punch 7 is pressed down to make an end 7a of punch 7 abut against the part near the throughhole 6 of tie-bar 3 to break down the part connecting the throughhole 6 of tie-bar 3 provided with less mechanical strength to the edges of resin package 4 by further pressing down the punch 7.
申请公布号 JPS62128163(A) 申请公布日期 1987.06.10
申请号 JP19850267301 申请日期 1985.11.29
申请人 NEC CORP 发明人 HASEBE YUTAKA
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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