发明名称 COMPOSITION FOR PROTECTING SEMICONDUCTOR WAFER
摘要 PURPOSE:To form a protective thin-film easily, and to remove the shaped thin- film easily and completely by water or an organic solvent by making polyethyl oxazoline contain as a main constituent for protecting a semiconductor wafer. CONSTITUTION:20wt.pt. polyethyl oxazoline and 80wt.pt. methanol are introduced to a sealed vessel, and agitated and dissolved, thus manufacturing a methanol solution of polyethyl oxazoline. The solution is applied onto the surface of a semiconductor wafer by using a spinner and dried. A protective film is approximately 30mum thick. The protective film can be removed completely when it is washed through the wafer shower (the quantity of water at 5l/min) of ion exchanging water. Since the composition has excellent solubility to each of water and an organic solvent, it is effective when preparing a protective liquid or when dissolving and removing the protective film.
申请公布号 JPS62128530(A) 申请公布日期 1987.06.10
申请号 JP19850270433 申请日期 1985.11.29
申请人 SEKISUI CHEM CO LTD 发明人 OKA OSHIO;YOSHISAKA NORIJI
分类号 H01L21/312 主分类号 H01L21/312
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