| 摘要 |
PURPOSE:To reduce the coloration of a sealing resin hardened body as well as to reduce the deterioration of elements and irregularity in characteristics of the titled semiconductor device by a method wherein semiconductor elements are sealed using the epoxy resin composition containing specific component. CONSTITUTION:An acid anhydride is used as a hardening agent for the epoxy resin containing carboxy group containing rubber-like polymer as a sealing epoxy resin composition. The coloration caused by the heat of an epoxy resin hardened body can be reduced markedly by conjointly using several kinds of compounds as an anti-oxidation agent. The above-mentioned epoxy resin composition is obtained using epoxy resin (A component), an acid anhydride (B component) which is turned to a hardening agent, carboxyl group containing diene rubber-like polymer (C component), hindered phenol compound (D component), and one of thioether compound (E component) and organic phosphite compound (F component). Normally, the above-mentioned material is in the form of solution. The hardened material of the epoxy resin composition has small internal stress, high transparency and excellent damp-proof property. |
