| 摘要 |
PURPOSE:To easily peel a tiny element from a flexible sheet by a method wherein the circumference of a tiny element bonded to the flexible sheet is pushed from the side of the sheet by an extruding pin eccentrically attached to a pressing jig and the tiny element is sucked and held to a vacuum pad tiltably movable as required. CONSTITUTION:A pressing jig 10 moves toward a sheet S. The pressing jig 10 temporarily supports a semiconductor pellet P when an opening is in close contact with the sheet S. A vacuum pad 12 is caused beforehand to be inclined at the same angle as the semiconductor pellet P and is so adjusted as to be positioned over the semiconductor pellet P that is inclined owing to an extruding pin 11. The vacuum pad 12, upon adsorption of the semiconductor pellet P thereto, is caused to gradually incline, for the semiconductor pellet P to be peeled from the sheet S little by little. A support 13 travels along the direction of the axle of the pressing jig 10 and the direction orthogonal to the axle. When a proper quantity of the semiconductor pellet has been peeled from the sheet S, the pad 12 is caused to stop inclining, the support 13 recedes along the direction of the axle, for the complete peeling of the pellet P from the sheet S.
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