| 摘要 |
A novel soluble polyimide-siloxane precursor having a good storage stability in solution and forming a superior coating on silicon wafer, glass, etc. under heating conditions of low temperature and short time; a process for producing the same; and a cross-linked polyimidesiloxane obtained by heating the above precursor are provided, which precursor has an imide-amic acid chain part expressed by the formula (1) <IMAGE> (1) bonded by a bonding structure expressed by the formula (5) -SiR73-kY1k-1-O-SiR73-kY1k-1-(5) wherein each I, in a total number of m+n+1, represents independently any one of constituting units expressed by the following formulas (2), (3) and (4): <IMAGE> (2) <IMAGE> (3) <IMAGE> (4) wherein R1 represents a tetravalent carbocyclic aromatic group; R2, R4, R5, R6, R7 and Y1 each are a specified group; l is 1 to 100; m is 0 or an integer; n is an integer; and 1</=k</=3, and which process comprises a first step of reacting a tetracarboxylic acid dianhydride, a diaminosiloxane, a diamine and an aminosilicon compound, each specified, in a solvent under specified conditions, and a second step of heating the resulting reaction solution in the presence of a silylating agent under specified reaction conditions.
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