发明名称 |
Multilayer ceramic circuit board |
摘要 |
A ceramic insulating layer (2) for the multilayer ceramic circuit board (11) consists of 60 wt % of crystallized glass and 40 wt % of a filler such as silicon dioxide bonded by the crystallized glass, which consists of 6-15 wt % of lithium oxide, 70-90 wt % of silicon dioxide, 1-8 wt % of aluminum oxide, 1-5 wt % of alkaline metal oxide other than lithium oxide and 2-5 wt % of alkaline earth metal oxide. The sintered ceramic insulating layer (2) has a dielectric constant below 6.1 and a flexural strength above 150 MPa and is co-firable with a wiring conductor layer of such as gold, silver and copper.
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申请公布号 |
US4672152(A) |
申请公布日期 |
1987.06.09 |
申请号 |
US19860888410 |
申请日期 |
1986.07.23 |
申请人 |
HITACHI, LTD. |
发明人 |
SHINOHARA, HIROICHI;USHIFUSA, NOBUYUKI;NAGAYAMA, KOUSEI;OGIHARA, SATORU |
分类号 |
C03C8/24;C03C10/00;H01L23/15;H01L23/538;H05K1/00;H05K1/03;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
C03C8/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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