| 摘要 |
A semiconductor rectifier unit composed of at least two rectifier elements, plate-shaped contact elements contacting each rectifier element, components producing spring pressure for clamping the rectifier elements between the contact elements, and a carrier body supporting the rectifier elements, contact elements and clamping components. Each rectifier element is composed of a semiconductor body having contact electrodes on opposite surfaces thereof and two contact members contacting the electrodes and forming a separable stack with the semiconductor body. A body of insulating material surrounds each rectifier element and is interposed between the contact elements to define therewith an enclosure for each rectifier element, and sealing rings form a sealed joint between the body of insulating material and each contact element for sealing the enclosure for each rectifier element. At least one plate-shaped cooling element is associated with, and dimensionally matched to, each rectifier element and is connected to one side of its associated rectifier element. The clamping components include at lest one member located at the side of the cooling element remote from the associated rectifier element for loading each rectifier element with a given contact pressure.
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