| 摘要 |
A side mold is disclosed which comprises a mold proper formed of a synthetic resin compound incorporating a plasticizer, a one-faced adhesive tape, and a curing adhesive agent containing a polar atomic group, with the one-faced adhesive tape joined fast to the mold proper through the medium of the curing type adhesive agent. Owing to the existence of the curing type adhesive agent layer containing the polar atomic group in the boundary between the rear side of the mold proper and the adhesive tape, even when the plasticizer in the mold proper exudes from the mold proper into the aforementined boundary, it is not allowed to form a layer of its own in the boundary and the otherwise inevitable degradation of the cohesive force of the aforementioned adhesive agent layer is curbed. Thus, sufficient adhesive strength is retained for a long time between the rear side of the mold proper and the adhesive tape.
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