| 摘要 |
<p>PURPOSE:To adhere a resin molding firmly to an adherend, by attaching the molding to the adherend through a specified sealant formed on the back of the molding and a specified adhesive. CONSTITUTION:An adhesive 4 is obtained by adding 0.007-10pts.wt. urethane prepolymer and/or polyisocyanate to 100pts.wt. (in terms of nonvolatiles) active hydrogen-containing acrylic adhesive comprising a (meth)acrylic acid derivative monomer and an active hydrogen compound (e.g., maleic acid). The back of a resin molding 2 is coated with a sealant of a Shore A hardness of 5-70 (e.g., urethane sealent) so that its thickness may be 5mm or below, and the surface of the sealant is coated with the above adhesive 4. The resin molding 2 is bonded to the adherend 1 through the sealant 3 and the adhesive 4.</p> |
