| 摘要 |
PURPOSE:To provide a lead frame having a structure wherein the lead frame and an inner wiring layer is hard to be separated even if a load is applied to the lead frame from the outside, by making the thickness of a part bonded to the inner wiring layer to be 1.3 times or more the thickness of another part, and protruding a bonding part toward a bonding surface from the other part. CONSTITUTION:A lead frame 3 is connected to an inner wiring layer 2 in a package, in which a semiconductor element is mounted, and electrically connects the semiconductor element 4 and an outer circuit substrate. In this lead frame 3, the thickness of a part, which is bonded to the inner wiring layer 2, is made to be 1.3 times or more the thickness of another part. The thickness of the other part is made to be 100mum or less. The bonding part is protruded toward a bonding surface from the other part. The reason why the thickness of the bonding part with the inner wiring layer is made to be 1.3 times or more the thickness of the other part is that the load absorption effect at the thin part is lost when the thickness is lower than that value. The shape of the bonding part prevents the direct application of the load, which is applied to the lead frame on the contact surface. When the thickness of the other part is 100mum or more, the rigidity at that part is enhanced, and the load absorption effect is strikingly decreased. |
