| 摘要 |
PURPOSE:To provide an LSI-chip mounting method at a low cost without restriction on a wiring conductor material for a substrate, by aligning a thermoplastic film, in which an LSI chip and conductor patterns undergo inner lead bonding, on a thermoplastic film, on the back surface of which moistureproof metal layer is provided, and on the top surface of which the wiring is formed, and thereafter performing heating and compression. CONSTITUTION:With a polyester film 1 as a thermoplastic film as a carrier film, an LSI chip 2 undergoes inner lead bonding. The LSI chip 2 is connected to a conductor pattern 3 comprising gold or gold plated copper. On the back surface of a polyester film substrate 4, a moisture proof metal layer 5 is formed. On the top surface of the substrate, a conductor pattern 6 as a wiring is formed beforehand. The polyester film 1 and the polyester film substrate 4 are aligned so that the conductor patterns 3 and 5 correspond to each other. Then, a thermoplastic package film 7 is set so as to cover these parts. By using a heating and compressing jig 8, heating and compressing processes are performed.
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