| 摘要 |
PURPOSE:To manufacture a copper-lined insulation substrate having an excellent bonding capability and heat-proof characteristic by injecting a specific hardening and injecting resin and cupper foil to a surounding frame in which a specific mold parting agent is coated on the inner face, mounted on a cupper foil to establish a hardening process. CONSTITUTION:A suspended liquid mold parting agent comprising weight percent of 0.5 to 6 of BN having a grain rate less than 30mu or MoS2, 0.2 to 3 weight percent of binder such as nitrocellulose and solvent of acetic acid ethyl is coated to the inner face of a surrounding frame having a desired depth and is dried at 20 to 50 deg.C. Subrequently, the surrounding frame is mounted on a copper foil placed on a flat plate, to the surrounding frame is injected a hardening and injecting resin having an apparent specific gravity of 1.2 to 1.8 and a viscosity of 200 to 1500 poise, obtained by mixing and dispersing 20 to 40 percent of thermoplastic resin, 25 to 45 percent of hardening agent such as polyamide, 2 to 10 percent of plasticizer such as polyethylen glycol and 30 to 45 percent of powder of crystal and talc. A copper foil is placed on the surface of the resin and is bonded by heat-hardening the resin. Finally, the surrounding frame is removed. |
