| 摘要 |
PURPOSE:To detect not only a detect in solder contact, but a defect in its adhesion and to detect a defect in soldering securely by feeding electricity to a wiring board through an inspection arm and taking a measurement while vibrating the wiring board by a vibration generating means. CONSTITUTION:The terminal part 3a of a measuring means 8 is brought into contact with the conductor part 2a of the printed wiring board 2 held by a fitting jig 7a at a specific position and electricity is fed. Then, an air cylinder 13 is driven to strike on the board 2 by a rubber pad 14a through the reciprocal motion of a piston part which is not shown in a figure. At this time, solder 5 formed on the board 2 and respective unit electronic systems 1 held by the solder 5 also vibrate and a part where the solder 5 is not adhered to a unit electronic system terminal 1a or conductor part 2a separates momentarily. The electricity feeding is broken because of the disconnection, so the solder nonadhesion part is easily detected.
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