| 摘要 |
PURPOSE:To obtain a semiconductor sealant resin usable to (very) large scale integrated circuit, etc., without causing the malfunction of a chip nor lowering the reliability, productivity and yield of the chip, by compounding a filler produced by mixing a large spherical particles with fine particles. CONSTITUTION:A sealant resin matrix (e.g. epoxy resin, silicone resin, etc.) is compounded with 30-90wt%, preferably 50-80wt% filler (e.g. silica, alumina, etc.) produced by mixing spherical coarse particles of >=20mum in diameter and crushed fine particles of <20mum in diameter.
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