发明名称 PHOTOSENSITIVE RESIN RELIEF
摘要 PURPOSE:To obtain a photosensitive resin relief having excellent high speed engaraving property, image reproducibility and printing effect by providing a relief layer consisting of two kinds of photosensitive resin layers of which the respective photosensitive characteristics have a specific relation and which have prescribed thicknesses on a substrate. CONSTITUTION:The relief layer of the photosensitive resin relief is constituted of the photosensitive resin layer A and the photosensitive resin layer B successively on the substrate and the thickness thereof is required to be make <=0.5mm in order to satisfy the high speed engraving property and high reproducibility. The lower limit of the thickness there of is switably selected by printing condition. The thickness of the photosensitive resin layer B at the top part constituting the printing surface is <=1/2 the thickness of the entire photosensitive resin layer, more preferably in a 0.03-0.2mm range. The min. quantity QA(mJ) of insolubilizing light which is the photosensitive characteristic by a TO method of said layer is <=5mJ and is required to be <=1/2 the min. quantity QB(mJ) of the photosensitive resin layer B constituting the top part of the relief layer.
申请公布号 JPS62124559(A) 申请公布日期 1987.06.05
申请号 JP19850264544 申请日期 1985.11.25
申请人 ASAHI CHEM IND CO LTD 发明人 KAWAMOTO TADASHI;SAWATAKE HITOSHI
分类号 G03F7/095;G03F7/00;(IPC1-7):G03F7/02 主分类号 G03F7/095
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