| 摘要 |
PURPOSE:To reduce troubles in a bonding packaging process and to realize a low cost manufacturing process by a method wherein a combination is used of a bonding wire material and a substrate material with a specific relation between them. CONSTITUTION:For the construction and packaging of a semiconductor element, wire bonding is accomplished by using ultrasonic waves. In this process a combination is used of a bonding wire material and a substrate material satisfying a specific relation (formula) between them. A substrate here means a semiconductor element electrode pad and a conductive layer on a lead frame. This method reduces troubles that may be encountered in a bonding packaging process and reduces the cost of the manufacturing process. |
