发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To keep a loop low in height and save the space required for wiring by a method wherein a pellet and external electrode are connected by a wire bonded to said pellet and external electrode by means of the wedge bonding method. CONSTITUTION:The end of a copper wire 15 is connected as prescribed to a bonding pad 14 positioned in a pellet 4 by means of the wedge bonding method incorporating ultrasonic oscillation. Next, the other end of the wire 15 is connected to a wiring pattern 11 by the same method, as the result of which the wire 15 loops a little. The wire 15 after connection to the pad 14 extends virtually on the same plane as the pad 14. The loop is kept low in height and such a wiring is useful in saving space.
申请公布号 JPS62123727(A) 申请公布日期 1987.06.05
申请号 JP19850262431 申请日期 1985.11.25
申请人 HITACHI LTD 发明人 TANIMOTO MICHIO;OKAMOTO MICHIO
分类号 G06K19/077;B42D15/02;B42D15/10;G06K19/00;H01L21/60 主分类号 G06K19/077
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