发明名称 |
Improved storage life of PB-in-AG solder foil by SN addition. |
摘要 |
<p>A lead based, tin free alloy is modified by adding thereto about .5 to 4 weight percent of tin. The alloy is rapidly solidi- fed by forming a melt thereof containing the tin addition and quenching the melt on a moving chill surface at a quenching rate of at least about 10<Sup>b</Sup> C sec. Addition of the tin inhibits formation of lead oxide film in the rapidly solidified alloy and substantially increases the storage life thereof.</p> |
申请公布号 |
EP0224068(A1) |
申请公布日期 |
1987.06.03 |
申请号 |
EP19860115075 |
申请日期 |
1986.10.30 |
申请人 |
ALLIED CORPORATION |
发明人 |
BOSE, DEBASIS;LIEBERMANN, HOWARD HORST |
分类号 |
B23K35/14;B23K35/26;B23K35/40;C22C11/00;C22C45/00;H05K3/34 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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