COOLING DEVICE FOR IC AND MANUFACTURE THEREOF

摘要

PURPOSE:To reduce the heat resistance by a method wherein a fine gap as the sum of the thickness of a spacer and another fine gap made by volumetric contraction of heat conductive fluid is made between an integrated circuit and the surface of heat conductive fluid layer. CONSTITUTION:A fine gap 10 of dimension h1 caused by volumetric contraction of molten solder is made between the surface of a solder layer 2 and an integrated circuit 3. An optimum dimension is set up that does not bring the integrated circuit 3 and the solder layer 2 into contact with each other despite the elastic deformation of a substrate 4 by adding the thickness of a spacer 6 to the dimension h1 of fine gap 10 making another fine gap 9. Such a fine gap 9 can be set up smaller than the integrated value of errors to reduce the heat resistance markedly since it has no restriction on the dimensional precision and the assembling precision of component parts at all.