发明名称 SOLID-STATE IMAGE PICK-UP DEVICE
摘要 PURPOSE:To miniaturize a mounting equipment by preventing any water content from entering a solid image pick-up element without fail by a method wherein a box body containing a solid-state image pick-up element whose image pickup part is coated with optical members integrally is filled with a filler containing at least one layer of moisture absorbent layer. CONSTITUTION:A CCD chip 10 is encircled with with a box body 17, cyanic filter 13, a first and a third optical LPF 14 and 16 through the intermediary of filler 18 containing a moisture absorbent layer 19. Resultantly, any water content enters the box body 17 only from the boundries between the filler 18 and box body 17, cyanic filter 13, the first and the third optical LPF 14, 16 and the filler 18. The water content entering from the boundaries is first absorbed by the filler 18 and the water content further entering the filler 18 is then absorbed by the moisture absorbent layer 19 preventing the water content from reaching the CCD chip 10. In such a constitution, when the CCD chip 10 is used as an image pick-up device of an endoscope, the device can be miniaturized since any specific moisture seal need not be provided.
申请公布号 JPS62122150(A) 申请公布日期 1987.06.03
申请号 JP19850261859 申请日期 1985.11.21
申请人 TOSHIBA CORP;TOSHIBA AUDIO VIDEO ENG CORP 发明人 OI KAZUNARI;NAKAMURA TAKAHIRO
分类号 H01L23/02;A61B1/04;H01L23/26;H01L27/14;H04N5/335;H04N5/372 主分类号 H01L23/02
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