发明名称 FRAME FOR RESIN MOLDED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make the flowing direction of a molding resin to be one direction and to make it possible to adopt a highly productive molding means such as injection molding, by constituting a frame for a semiconductor device so that many die area parts, on which semiconductor chips are mounted and fixed, are continuously formed in the longitudinal direction of the die area parts. CONSTITUTION:Die area parts 2 are continuously formed in the longitudinal direction of the die area part 2 by a required number, and a frame 1 is constituted. A hole 5 is provided at a part of a beam 6 and used so that the beam 6 is supported in order to prevent the deformation of the beam at the time of molding. The hole 5 is also used for sending every device. In this constitution, expensive frame material can be saved. Since the flowing direction of a molding resin can be made to be one direction, a metal mold can be readily manufactured. Therefore, a highly productive means such as an injection molding method can be used.
申请公布号 JPS62122254(A) 申请公布日期 1987.06.03
申请号 JP19850262745 申请日期 1985.11.22
申请人 MITSUBISHI ELECTRIC CORP 发明人 KONDO TAKASHI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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