| 摘要 |
PURPOSE:To prevent peeling of a package for a semiconductor device, by providing outer leads on the short sides of a package part, closely arranging inner leads to electrode pads, thereby expanding the junction area in a lead forming surface on the long sides. CONSTITUTION:A package 1 has a rectangular shape in the right and left directions. Outer leads 4a are formed on the short side of the package 1. A semiconductor pellet mounted on the package has a rectangular shape, too. Electrode pads 6 are arranged along the short sides of the pellet 3. Therefore, the inner end parts of inner leads 4b can be brought closer to the electrode pads by only extending the inner leads 4b from the side ends of the package. Thus, bonding of a package resin at a lead forming surface can be sufficiently performed in the package part on the long sides, where margin is small. Peeling of the package resin at the package part can be also prevented. |
