| 摘要 |
PURPOSE:To prevent a microrack and the thickness variations of surface treatment material from occuring by a method wherein, during the bonding process of an outer lead, the nearest bent pa is held for bending process. CONSTITUTION:During a first bending process, the central part is held by a die 32B and a knockout 34B leaving the end of horizontally extending outer lead 30a to be bent along the curved part 32a of die 32B by a punch 36B meeting the knockout 34B at almost right angle. During a second bending process, the outer lead 30a is bent at an angle of 45 deg. along a curved surface 33b. During a third bending process, a semiconductor device 30 is held by another die 32c while the outer lead 30a is bent almost perpendicularly. Finally during a fourth bending process, the preliminary curling process to bend the end of outer lead 30a describing an arc as well as the formation curling process are performed. |
