发明名称 FUNCTION TRIMMING METHOD OF THIN FILM HYBRID INTEGRATED CIRCUIT
摘要 <p>PURPOSE:To make it possible to cut a thick film resistor with laser and the like as required, by providing a parallel connecting circuits of the thick film resistor and a resistor having a surface, as a function trimming resistor between the stages of electric circuits. CONSTITUTION:On an insulating substrate 6 made of ceramics and the like, a thick film conductor 5 and a thick film resistor 2 are formed. Thereafter, the value of the thick film resistor 2 is adjusted to the desired value with laser and the like at a resistance value adjusting part 9. A resistor having a surface 3 and a discrete part 4 are soldered, and a thick film hybrid integrated circuit is formed. Resistors R1 and R2 are connected in parallel. Resistors R3 and R4 are connected in parallel. The circuit is made to be an operating state. When the electric characteristics are deviated from intended values, the resistors R1 or R3 is cut at a resistor cutting place 8 or 9, and the intended values of the electric characteristics are obtained. The resistance values of the resistors R1-F4 are adjusted. The electric characteristics can be adjusted accurately to the intended values. The occupying areas of the resistors required for function trimming can be made small.</p>
申请公布号 JPS62122259(A) 申请公布日期 1987.06.03
申请号 JP19850261032 申请日期 1985.11.22
申请人 HITACHI LTD 发明人 KAMIAKUTSU MASAKI;MATSUDA KIYOSHI
分类号 H01L27/01;H01C17/22;H01C17/24;H05K1/16;H05K1/18 主分类号 H01L27/01
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