发明名称 COOLING ARRANGEMENT
摘要 A cooling arrangement for high power components such as semi-conductors (1) includes a chamber (10), a lower portion (3) of which contains a liquid (11) to which heat can be applied to vaporise some of the liquid. An upper portion (5) of the chamber constitutes a condensation region at which vaporise liquid is condensed. Means (14,15) is included for monitoring a difference in temperature between the upper and lower portions and which is indicative of an incomplete filling of the chamber with the liquid and its vapor.
申请公布号 GB8710509(D0) 申请公布日期 1987.06.03
申请号 GB19870010509 申请日期 1987.05.02
申请人 MARCONI ELECTRONIC DEVICES LTD 发明人
分类号 H01L23/427 主分类号 H01L23/427
代理机构 代理人
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