发明名称 ENCAPSULATING MOLD PROVIDED WITH PRESSURE SENSOR
摘要 PURPOSE:To prevent a wire deformation or poor shot of resin, by providing an encapsulating mold embedded with a pressure sensor and a servovalve controlling a speed and pressure of a plunger by output of the sensor. CONSTITUTION:A signal is entered into a pressure detector 9 from a pressure sensor 11 buried into the inside of a mold and resin is kept pressurizing while a pressure curve is being displayed as per a sketch during encapsulating process. Then a position detecting sensor 3 of a linear scale connected with a plunger 2 is fixed to the plunger 2. A position of the plunger 2 displayed by the position- detecting sensor 3 is sent to a control part 8 moment by moment from a position detector 4, through which a speed of the plunger is calculated by measuring a period within the control part 8. The control part 8 is controlling a throttle quantity of a valve and pressure of a hydraulic servovalve 6 driving the plunger and controls a speed and the pressure of the plunger based on a signal of the control part 8. Lowering pressure of the plunger is measured by a pressure gauge 5, feed back of a value of which is applied to the control part 8 and corrective control of the servovalve 6 is performed.
申请公布号 JPS62121028(A) 申请公布日期 1987.06.02
申请号 JP19850262100 申请日期 1985.11.21
申请人 NEC CORP 发明人 SHIROYAMA MASAMI
分类号 H01L21/56;B29C45/26;B29C45/77 主分类号 H01L21/56
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