Apparatus for singling filled wafer slices

摘要

When it is desired to single consecutive filled wafer slices, which are advanced with abutting trailing and leading faces, respectively, so that the singled wafer slices are ultimately spaced apart, a separation between consecutive wafer slices is to be effected in time even if the wafer slices are filled with cream so that their filling layers will strongly adhere to each other. This can be ensured in that a transfer device is provided between a feeding conveyor for advancing consecutive wafer slices abutting at their trailing and leading faces, respectively, and a delivering conveyor for advancing the rows of wafer slices on a delivery plane, which is vertically spaced from the feeding plane, on which the wafer slices are advanced by the feeding conveyor, and the transfer device pulls each leading wafer slice from the next succeeding wafer slice and moves the pulled-off wafer slice to the delivery plane.