Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure

摘要

A structure comprising on a substrate successive layers of metal circuitry having therebetween as a dielectric a cured polyimide composition containing a polyimide and aluminum oxide or zinc oxide or mixtures thereof. The structure is produced by a method including the following process steps: blanket screen printing a mixture containing a polyamido carboxylic acid, aluminum oxide or zinc oxide or mixtures thereof and a detackifier with the rest being a solvent on a substrate with a layer of metal circuitry thereon, drying the deposited layer at a temperature between about 25 DEG and about 120 DEG C., selectively etching holes into the deposited layer where vias between adjacent layers of metal circuitry are needed, curing the deposited layer at a temperature between about 300 DEG and about 400 DEG C. and forming another layer of metal circuitry.