Flexible printed circuits, prepared by augmentation replacement process

摘要

The present invention provides flexible printed circuits prepared by (i) applying a design on a silicone-impregnated fabric substrate with a printing ink comprising a mixture of (a) a curable silicone composition and (b) an effective amount of at least one finely divided metal powder; (ii) at least partially curing said silicone composition; and (iii) depositing a conductive metal on the surface of said printing ink.