发明名称 COMPOSITE PLATING METHOD
摘要 PURPOSE:To form a composite plated silver-oxide film contg. uniformly and finely dispersed metallic oxide and having the superior performance of a contact point by using a silver plating bath contg. suspended fine metallic oxide particles and by supplying a specified DC pulsating current. CONSTITUTION:A contact point material having superior wear resistance and superior characteristics of a contact point for an electric apparatus is formed by silver-oxide composite plating. At this time, a silver plating bath contg. the dispersed particles of one or more among CdO, SnO2, In2O3, ZnO, CuO, Sb2O3, La2O3, MgO, MnO2, Bi2O3 and TeO each having 0.01-1mum particle size and 40-100g/l (expressed in terms of silver) dissolved silver cyanide but not contg. other cyanide is used, and a pulsating current is supplied at 5-150A/dm<2> average current density with 50msec-5sec period in which the ratio of DC pulse is 0.5-0.9. A thick composite plated silver-oxide film is obtd.
申请公布号 JPS62120497(A) 申请公布日期 1987.06.01
申请号 JP19850257713 申请日期 1985.11.19
申请人 YASKAWA ELECTRIC MFG CO LTD 发明人 KAKO HISAYUKI;HARA KENJI
分类号 H01H11/04;C25D15/02;H01R39/20 主分类号 H01H11/04
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