发明名称 METAL MOLD FRAME OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To effectively improve the characteristics of a semiconductor element by branching inner leads after outer leads to become outer pins on a necessary portion into a plurality to individually separate a common impedance of the inner leads. CONSTITUTION:Pads 6a, 7a of AVcc, Avss for power source to an A/D converter, and pads 6b, 7b of Vcc, Vss for power source to the other section are provided. When the number of outer leads of outer pins has a margin, it is desirable to provide four power sources AVcc, AVss and Vcc, Vss. However, when only two may be provided, the ends of two inner leads 2a, 2b and 2a, 2b branched from two outer leads 1a, 1b as external pins are connected with the pads 6a, 6b and 7a, 7b, for example, by two wirings 5a, 5b and 5b, 5b of gold or aluminum wirings. The common impedance of the inner leads is separated to improve the characteristics.
申请公布号 JPS62120056(A) 申请公布日期 1987.06.01
申请号 JP19850261685 申请日期 1985.11.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISHIMARU YOSHIYUKI
分类号 H01L23/50;H01L23/64 主分类号 H01L23/50
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