| 摘要 |
PURPOSE:To improve a discharge resistance by covering the back surface and the front exposed portion of a substrate support with the first resin and the second resin having good bondability with a lead frame to eliminate a swelling phenomenon. CONSTITUTION:The back surface and the front exposed surface 6 of a substrate support 3 are covered with the first resin and the second resin having good bondability with a lead frame. The first resin uses, for example, epoxy resin, and the second resin 7 uses polyimide resin. Since the second resin 7 has good bondability with the first resin 5 and the lead frame 2, even if the lead frame is, for example, oxidized, the bondability is improved to eliminate a swelling phenomenon. Since the exposed surface 6 of the support 3 is covered with the resin 7, a discharge resistance is improved.
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