| 摘要 |
PURPOSE:To prevent local deviation of electric charge and to prevent a high potential at a local plate, by forming a highly resistive printed resistor film on the entire surface of a substrate except for electrodes and an integrated- circuit-chip attaching part of the substrate, thereby uniformly distributing the electric charge on the entire surface of the integrated-circuit mounting substrate and an IC. CONSTITUTION:A COB is formed as follows. An integrated-circuit chip 2 is mounted on an insulating substrate 1. Electrodes 3 are taken out of the integrated circuit chip and arranged on the insulating substrate. A highly-resistive printed resistor film 7 is formed on the entire surface except for an integrated- circuit-chip attaching part and the electrode on the substrate. Thus, the highly resistive (about 1MOMEGA/square) printed resistor is applied on the entire surface of the COB. Therefore the substrate of the COB and the IC become the almost equal potential. |
