| 摘要 |
PURPOSE:To provide a metal foil adhesive for laminates suited for producing highly reliable laminates which are excellent in surface resistance, antitracking properties and other electrical properties and are desirably low in warping after heating, which comprises particular amts. of an epoxy resin, an amino resin and a butyral resin as resin components. CONSTITUTION:The titled adhesive is obtd. by blending a resin compsn. comprised of 3-6pts.wt. epoxy resin such as phenolic epoxy resins, e.g., bisphenol A or F epoxy resin, 5-7pts.wt. amino resin such as a melamine resin, a urea resin or the like and 8-12pts.wt. butyral resin, a curing accelerator such as diaminodiphenylmethane, and a curing agent such as an isocyanate curing agent, optionally together with 75-84pts.wt. (mixed) solvent, e.g., a ketone solvent and/or an arom. solvent. This adhesive 4 is applied onto a substrate (insulating layer) 1 such as a resin sheet and/or a prepreg at a thickness of 5-100mum, and is caused to adhere to a metal foil 3 such as a copper foil or the like, thereby obtaining a laminate 1.
|
