CONNECTION OF CIRCUIT SUBSTRATE,申请号JP19850258363-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	CONNECTION OF CIRCUIT SUBSTRATE
摘要
申请公布号	JPS62117391(A)	申请公布日期	1987.05.28
申请号	JP19850258363	申请日期	1985.11.18
申请人	BROTHER IND LTD	发明人	SHIMIZU HIROSHI;KAKO MITSUMASA
分类号	H01R43/02;H01R43/00;H05K3/36	主分类号	H01R43/02
代理机构		代理人
主权项
地址

您可能感兴趣的专利

自行车车轮钢线护盘(9)

A DEVICE AND METHOD FOR RECOVERING ANAESTHETIC DURING THE USE OF INHALED ANAESTHETICS

High frequency heating coil device

Process for determining dynamic properties of motor vehicles

Combinatorial weighing apparatus

Temperature control system

Sintered nickel-plated iron substrate for an electrode in an alkaline storage battery, method for making the same and alkaline storage battery containing the electrode

Cellulose ester composition

Ethylene polymers for layered extrusion

Aqueous hairstyling composition containing gamma-oryzanol and calcium salts

Inductance device with gap

Apparatus for reproducing information recorded on optical disc

Method of manufacturing a high capacitance capacitor using sputtering

Semiconductor memory with stacked structure

苯的液相烷基化方法

MULTI-CAVITY DISPENSING CONTAINER

运行空间扩展数字电信交换局所属用户线单元设备的方法