| 摘要 |
PURPOSE:To form a plating layer having high quality and uniform thickness over the entire region of a material to be treated by providing a liquid flow forming means for a plating liquid from the material to be treated as a cathode toward anode plates disposed to face the same in an electrolytic cell. CONSTITUTION:Wafers 4a, 4b which are the material to be treated as the cathode are mounted on a jig plate 5 and anode plates 7a, 7b having meshed anode parts 8a, 8b of approximately the same shape as the shape of the wafers 4a, 4 are disposed to face the wafers in the electrolytic cell 3. Shielding cylinders 10a, 10b having the inside diameter of approximately the same shape as the shape of the wafers 4a, 4b are disposed apart at a slight space from the wafers 4a, 4b in the wafer 4a, 4b direction from the above-mentioned anode parts 8a, 8b in such electrolytic cell. Inflow ports 11a, 11b provided between the anode plates 7a, 7b and the plate 5 and outflow parts 13a, 13b provided between the anode plates 7a, 7b and cell walls 12a, 12b are connected by connecting pipes 14a, 14b interposed with a pump 15 to form the flow of the plating liquid 2 in the arrow direction. |
