发明名称 VAPOR ETCHING TANK
摘要 PURPOSE:To prevent the generation of dulling and fouling on a wafer by etching the wafer housed to the upper section of an etching tank by the vaporization of an etching liquid stored to the lower section of the tank. CONSTITUTION:An etching tank 10 is divided into upper and lower spaces by an intermediate bottom 11 with a through-hole, and a carrier 2 on which a wafer 1 is placed is housed in the upper space, and sealed by a cover body 20. The wafer is etched by the vapor of an etching liquid introduced into the lower space of the tank 10 from an etching liquid tank 15. When etching is completed, the etching liquid is discharged from a discharge pipe 16, and pure water from a pure-water supply pipe 22 is scattered onto the wafer 1 from a water spray pipe 21 and the wafer is washed. When using the tank 10, the dulling and fouling of the wafer due to particles and impurities in the etching liquid can be avoided, and pure-water washing can be conducted continuously.
申请公布号 JPS62117332(A) 申请公布日期 1987.05.28
申请号 JP19850257931 申请日期 1985.11.18
申请人 TOSHIBA CORP 发明人 ADACHI HISAKIMI
分类号 H01L21/306 主分类号 H01L21/306
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