| 摘要 |
PURPOSE:To form an adhesive layer in uniform thickness onto a cap for sealing by peeling an organic group resin, which is applied onto a member for releasing a mold to a predetermined shape and thermally treated, loading the resin on the cap and heating and melting the resin. CONSTITUTION:An organic group resin 1 (such as an epoxy resin) is applied onto a board or a film 2 for releasing a mold to a prescribed shape in uniform thickness through a method such as a screen printing method, thermally treated and solidified. A solidified resin 1a is peeled from the film 2, and loaded onto a cap 3 for sealing and heated and melted. Since an oxide film is formed previously onto the cap 3, the resin 1a is fast stuck firmly onto the cap 3. According to the method, an adhesive layer in equal film thickness can be shaped even onto the cap with a complicated shape. |
